School of Dentistry Develop ‘Nanocoating’ for Dental Implants

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  • 4th April 2017

Peninsula Schools of Medicine and Dentistry and the University of Plymouth looking at small things making a big difference

Borrowing some of the same processes used in the semiconductor industry, the Peninsula Schools of Medicine and Dentistry and the University of Plymouth have developed new nanocoating materials for dental implants.

Some three million Americans have dental implants, according to the American Academy of Implant Dentistry (AAID). This number is rising by 500,000 a year, according to AAID. But 5% to 10% of all dental implants fail, due to poor connection to the bone and other issues.

In response, the Peninsula Schools of Medicine and Dentistry and the University of Plymouth have devised new dental implant materials that promise to reduce the risk of peri-implantitis, an inflammatory process affecting the tissues around the dental implants.

dentistry

“Current strategies to render the surface of dental implants antibacterial with the aim to prevent infection and peri-implantitis development, include application of antimicrobial coatings loaded with antibiotics or chlorhexidine. The significance of our new study is that we have successfully applied a dual-layered silver-hydroxyapatite nanocoating to titanium alloy medical implants which helps to overcome these risks.” – Alexandros Besinis, a lecturer in Mechanical Engineering at the School of Engineering at University of Plymouth

The National Physical Laboratory (NPL) has developed a multi-parameter microscope.

The technology from NPL is called simultaneous topographical, electrical, chemical and optical microscopy (STEOM). STEOM is a non-destructive technique, which combines plasmonic optical signal enhancement technology with electrical-mode scanning probe microscopy.

The Institut Fresnel, IBM and the U.S. Department of Energy’s (DOE) Argonne National Laboratory have developed a new form of X-ray metrology called single-angle Bragg ptychography. The technique provides three-dimensional images of stressed materials. More specifically, the technology provides a better picture of how planes of atoms shift and squeeze under stress, a series of events that could help enable current and future chips

To find out more about this fascinating technology and more information on the research, click here.

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