Moortec announce their Embedded In-Chip Monitoring Subsystem on TSMC 12FFC

  • 1
  • 25th January 2018

Moortec, specialist in embedded in-chip sensing, is pleased to announce the availability of their easy to integrate, high accuracy, embedded monitoring subsystem on TSMC’s 12nm FinFET Compact process technology (FFC).

Moortech sub system

Moortec’s Embedded In-Chip Monitoring Subsystem

Moortec’s Process, Voltage and Temperature (PVT) monitoring IP is designed to optimise performance in today’s cutting-edge technologies, solving the problems that come about through scaling of devices. Applications include Datacentre & Enterprise, Automotive, AI, Mobile, IoT, Consumer and Telecommunications.

Within the new 12nm subsystem the Process Monitor provides the means for advanced node Integrated Circuit (IC) developers to detect the process variation of 12nm core digital MOS devices. The Process Monitor can also be used to enable continuous Dynamic Frequency and Voltage Scaling (DVFS) optimisation systems, monitor manufacturing variability across chip, gate delay measurements, critical path analysis, critical voltage analysis and also monitor silicon ‘ageing’.

The subsystem also includes a Voltage Monitor which is a low power self-contained IP block specially designed to monitor voltage levels within the core logic voltage domains and provide accurate IR drop analysis.

The measurement range is customized to suit each technology. The monitor IP can also monitor analogue (IO) supply domains and is also well-suited to monitoring supply droops and perturbations.

To complete the system there is a high precision low power junction Temperature Sensor which has been developed to be embedded into ASIC designs. It can be used for a number of different applications including DVFS, device lifetime enhancement, device characterisation and thermal profiling.

The package includes a sophisticated PVT Controller with AMBA APB interfacing, which supports multiple monitor instances, statistics gathering, a production test access port as well as other compelling features.

In-chip monitoring has become a vital factor in the design and performance optimisation of small-geometry designs. Since 2010 Moortec have brought to market a highly featured embedded in-chip PVT sensing fabric for use within advanced node CMOS technologies from 40nm down to 7nm.

The package includes a sophisticated PVT Controller with AMBA APB interfacing, which supports multiple monitor instances, statistics gathering, a production test access port as well as other compelling features. In-chip monitoring has become a vital factor in the design and performance optimisation of small-geometry designs.

Since 2010 Moortec have brought to market a highly featured embedded in-chip PVT sensing fabric for use within advanced node CMOS technologies from 40nm down to 7nm.

Alongside the IP offering, Moortec provides expertise on macro placement, production result analysis and support and guidance on how to implement DVFS/AVS optimisation & reliability schemes. As a big growth area for advanced technology design, Moortec is able to help our customers understand more about architecting and implementing such schemes, with Moortec being considered a centre-point for such expertise.

“As much as ever, advanced node IC developers need to maintain product competitiveness. Embedded monitoring is enabling individual chip optimisation for power or speed, providing a significant benefit to the design community. We are pleased to be providing such technology enablement on TSMC’s 12nm technology and to be working with the ecosystem’s customers,” said Stephen Crosher, CEO of Moortec.

For more information, please visit www.moortec.com

 

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